• DocumentCode
    3342658
  • Title

    PSpice modeling of the acoustic detector for a pulsed electro-acoustic cell

  • Author

    Galloy, L. ; Berquez, Laurent ; Baudoin, F. ; Payan, Denis

  • Author_Institution
    Lab. Plasma et Conversion d´Energie, Univ. Paul Sabatier, Toulouse, France
  • fYear
    2013
  • fDate
    June 30 2013-July 4 2013
  • Firstpage
    468
  • Lastpage
    471
  • Abstract
    This study aims at improving the spatial resolution for the pulsed electro-acoustic method - PEA. Indeed, the actual spatial resolution of this method is in order of ten μm while dielectric films used as thermal regulators in the structures of the satellites and analyzed by the PEA method are around 50-μm-thick. Also a better resolution is expected to provide a better description of charges in these materials. Previous studies have shown that the spatial resolution is strongly linked to the acoustic waves´ propagation in the PEA measurement cell. In this respect, the acoustic detector, which is the key of the PEA method, must be optimized in order to improve the performance of this method. This work is focused on the model of the acoustic detector created with the commercial software PSpice and based on the Mason-Redwood model. It permits analysis of the influence of the piezoelectric transducer´s losses and of the nature of the absorber on the output voltage signal.
  • Keywords
    SPICE; acoustic wave propagation; acoustoelectric transducers; Mason-Redwood model; PEA measurement cell; PSpice modeling; acoustic detector; acoustic waves propagation; actual spatial resolution; commercial software PSpice; dielectric films; output voltage signal; piezoelectric transducer; pulsed electroacoustic cell; pulsed electroacoustic method; thermal regulators; Acoustic waves; Detectors; Electrodes; Impedance; Integrated circuit modeling; Materials; Pulsed electro-acoustic method; acoustic detector; dielectric losses; piezoelectric conversion; space charge;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Solid Dielectrics (ICSD), 2013 IEEE International Conference on
  • Conference_Location
    Bologna
  • ISSN
    2159-1687
  • Print_ISBN
    978-1-4799-0807-3
  • Type

    conf

  • DOI
    10.1109/ICSD.2013.6619809
  • Filename
    6619809