• DocumentCode
    3343176
  • Title

    Synthesis and evaluation of thermoelectric multilayer films

  • Author

    Wagner, Andrew V. ; Foreman, Ronald J. ; Summers, Leslie J. ; Barbee, Troy W. ; Farmer, Joseph C.

  • Author_Institution
    Dept. of Chem. & Mater. Sci., Lawrence Livermore Nat. Lab., CA, USA
  • fYear
    1996
  • fDate
    26-29 March 1996
  • Firstpage
    459
  • Lastpage
    463
  • Abstract
    The deposition of compositionally-modulated (Bi/sub 1-x/Sb/sub x/)/sub 2/(Te/sub 1-y/Se/sub y/)/sub 3/ thermoelectric multilayer films by magnetron sputtering has been demonstrated. Structures with a period of 140 /spl Aring/ are shown to be stable to interdiffusion at the high deposition temperatures necessary for growth of single-layer crystalline films with ZT>0.5. These multilayers are of the correct dimension to exhibit the electronic properties of quantum well structures. Furthermore it is shown that the Seebeck coefficient of the films is not degraded by the presence of this multilayer structure. It may be possible to synthesize a multilayer thermoelectric material with enhanced ZT by maximizing the barrier height through optimization of the composition of the barrier.
  • Keywords
    Seebeck effect; bismuth compounds; chemical interdiffusion; semiconductor growth; semiconductor materials; semiconductor superlattices; semiconductor thin films; sputtered coatings; surface diffusion; thermoelectric power; (Bi/sub 1-x/Sb/sub x/)/sub 2/(Te/sub 1-y/Se/sub y/)/sub 3/; (BiSb)/sub 2/(TeSe)/sub 3/; 140 A; Seebeck coefficient; barrier height; deposition; interdiffusion; magnetron sputtering; thermoelectric multilayer films; Bismuth; Composite materials; Crystallization; Degradation; Magnetic multilayers; Nonhomogeneous media; Sputtering; Tellurium; Temperature; Thermoelectricity;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Thermoelectrics, 1996., Fifteenth International Conference on
  • Conference_Location
    Pasadena, CA, USA
  • Print_ISBN
    0-7803-3221-0
  • Type

    conf

  • DOI
    10.1109/ICT.1996.553527
  • Filename
    553527