DocumentCode :
3343358
Title :
Thermoelectric figure of merit of Si-Ge multilayered thin films
Author :
Yamamoto, Atsushi ; Ohta, Toshitaka
Author_Institution :
Electrotech. Lab., Ibaraki, Japan
fYear :
1996
fDate :
26-29 March 1996
Firstpage :
464
Lastpage :
468
Abstract :
The electrical conductivity /spl sigma/, the Seebeck coefficient /spl alpha/, the thermal conductivity /spl kappa/ and the figure of merit ZT (Z=/spl sigma/ /spl alpha//sup 2///spl kappa/) were calculated theoretically for multilayered thin film with quantum wells (QWs) made of Si, Si/sub 70/Ge/sub 30/ and silicide thermoelectric materials. Two-dimensional transport model for single band semiconductor was applied to these materials. As results of the calculation it is found that carrier confinement by QWs mainly have effects on increasing the carrier energy and on shifting optimizing point of power factor /spl sigma/ /spl alpha//sup 2/. The calculated figure of merit for modulated doping Si/sub 70/Ge/sub 30/ QWs was the same as that of bulk material at 300 K. Modulated doping silicide QWs had larger figure of merit than that of Si/sub 70/Ge/sub 30/ QWs.
Keywords :
Ge-Si alloys; Seebeck effect; electrical conductivity; power factor; semiconductor materials; semiconductor quantum wells; semiconductor thin films; thermal conductivity; thermoelectric power; Seebeck coefficient; Si-Ge; Si-Ge multilayered thin films; Si/sub 70/Ge/sub 30/; carrier confinement; electrical conductivity; quantum wells; single band semiconductor; thermal conductivity; thermoelectric figure of merit; two-dimensional transport model; Carrier confinement; Conducting materials; Quantum mechanics; Reactive power; Semiconductor materials; Semiconductor thin films; Silicides; Thermal conductivity; Thermoelectricity; Transistors;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Thermoelectrics, 1996., Fifteenth International Conference on
Conference_Location :
Pasadena, CA, USA
Print_ISBN :
0-7803-3221-0
Type :
conf
DOI :
10.1109/ICT.1996.553528
Filename :
553528
Link To Document :
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