Title :
The influence of compatibilizer on structural morphology and dielectric property of crosslinked polyethylene/montmorillonite nanocomposites
Author :
Li Xiufeng ; Xu Man ; Liu Xin ; Zhang Kai ; Xie Darong ; Tong Jianping ; Cao Xiaolong
Author_Institution :
State Key Lab. of Electr. Insulation & Power Equip., Xi´an Jiaotong Univ., Xi´an, China
fDate :
June 30 2013-July 4 2013
Abstract :
In this paper, a series of montmorillonite/Cross-linked polyethylene nanocomposites containing different compatililizer (vinyl acetate copolymer (EVA) or ethylene-ethyl acrylate (EEA)) are prepared by melting blending method. The influence of compatibilizer on the dielectric property of the nanocomposites is studied. DSC is used to study the melting and crystallization behaviors of nanocomposites with and without compatibilizer. Dielectric spectrum of the nanocomposite is tested in room temperature. Dielectric constant and loss factor of different nanocomposites in wide frequency range are analyzed and the dynamic polarization behavior is discussed by the universal relaxation law (URL). Based on the structure characteristics, the effect of compatibilizer on the nanocomposite polarization is obtained.
Keywords :
aluminium compounds; calcium compounds; dielectric polarisation; dielectric relaxation; filled polymers; magnesium compounds; minerals; nanocomposites; nanofabrication; permittivity; polymer blends; sodium compounds; (NaCa)0.33(AlMg)2Si4O10(OH)2-H2O; crosslinked polyethylene-montmorillonite nanocomposites; crystallization; dielectric constant; dielectric property; dielectric spectrum; dynamic polarization behavior; ethylene-ethyl acrylate; loss factor; melting blending method; structural morphology; temperature 293 K to 298 K; universal relaxation law; vinyl acetate copolymer; Crystallization; Dielectric constant; Nanocomposites; Polarization; Polymers; Temperature distribution; dielectric property; montorillonite; nanocomposite; universal relaxation law Crosslinked polyethylene;
Conference_Titel :
Solid Dielectrics (ICSD), 2013 IEEE International Conference on
Conference_Location :
Bologna
Print_ISBN :
978-1-4799-0807-3
DOI :
10.1109/ICSD.2013.6619869
