DocumentCode
3343874
Title
Non-vacuum printing process for CIGS solar cells on rigid and flexible substrates
Author
Kapur, Vijay K. ; Bansal, Ashish ; Le, Phucan ; Asensio, Omar I.
Author_Institution
Int. Solar Electr. Technol., Inglewood, CA, USA
fYear
2002
fDate
19-24 May 2002
Firstpage
688
Lastpage
691
Abstract
ISET has developed an ink based non-vacuum process for fabricating thin film CIGS solar cells both on rigid and flexible substrates. The key benefits of this process are (1) controlled stoichiometry of the absorber layer resulting in a high process yield, (2) high materials utilization and (3) low cost of processing equipment. The combined effect of these attributes of this process is low-cost manufacturing of CIGS solar cells. Using this process, ISET has fabricated CIGS solar cells on glass and other flexible substrates. The highest conversion efficiency observed in CIGS solar cells fabricated is 13.6% on glass substrate and 10.1% on Mo foil. Because this process uses inks, a number of relatively low cost printing technologies are available for processing absorber layers in CIGS solar cell. The basic principles of this novel approach and the results obtained are discussed in this paper.
Keywords
copper compounds; gallium compounds; indium compounds; printing; semiconductor device manufacture; solar cells; stoichiometry; substrates; ternary semiconductors; 10.1 percent; 13.6 percent; Cu(InGa)Se2; Mo; Mo foil; absorber layer; controlled stoichiometry; conversion efficiency; flexible substrates; glass substrate; high materials utilization; high process yield; ink based nonvacuum process; large-scale applications; low cost manufacturing; nonvacuum printing process; processing equipment; rigid substrates; thin film CIGS solar cells; Commercialization; Costs; Ink; Manufacturing processes; Photovoltaic cells; Printing; Semiconductor thin films; Stability; Substrates; Transistors;
fLanguage
English
Publisher
ieee
Conference_Titel
Photovoltaic Specialists Conference, 2002. Conference Record of the Twenty-Ninth IEEE
ISSN
1060-8371
Print_ISBN
0-7803-7471-1
Type
conf
DOI
10.1109/PVSC.2002.1190658
Filename
1190658
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