DocumentCode
3344602
Title
Space charge probing in dielectrics at nanometer scale by techniques derived from atomic force microscopy
Author
Villeneuve, Christina ; Teyssedre, Gilbert ; Mortreuil, Florian ; Boudou, Laurent ; Makasheva, Kremena
Author_Institution
LAPLA CE (Lab. Plasma et Conversion d´Energie), Univ. de Toulouse; UPS, Toulouse, France
fYear
2013
fDate
June 30 2013-July 4 2013
Firstpage
940
Lastpage
943
Abstract
Charges accumulation and injection in dielectric material remains critical because it is related to a lot of applications or issues. A deep understanding of interfaces phenomena is needed, but classical space charges techniques exhibit less resolution than the required one. Atomic Force Microscopy (AFM) because of its sensitivity to electrostatic force and its high resolution (close to nanometer) appears to be the best method to characterize charges at nanoscale. Here, two techniques are investigated and compare: Kelvin Force Microscopy (KFM) and Electrostatic Force Distance Curve (EFDC). KFM is used to measured surface potential modification induced by charges. However vertical localization of charges seems difficult to attempt. EFDC follows electrostatic force as function of tip-surface distance. This technique appears promising because of its high resolution, sensitivity to charges localization and distance dependance.
Keywords
atomic force microscopy; dielectric materials; localised modes; space charge; surface potential; AFM; EFDC; KFM; Kelvin Force Microscopy; atomic force microscopy; charge localization; classical space charge techniques; dielectric material injection; electrostatic force; electrostatic force distance curve; sensitivity analysis; space charge probing; surface potential modification; tip-surface distance; vertical localization; Dielectrics; Electric potential; Electrostatic measurements; Electrostatics; Force; Microscopy; Sensitivity; AFM; electrostatic force; space charge; surface potential;
fLanguage
English
Publisher
ieee
Conference_Titel
Solid Dielectrics (ICSD), 2013 IEEE International Conference on
Conference_Location
Bologna
ISSN
2159-1687
Print_ISBN
978-1-4799-0807-3
Type
conf
DOI
10.1109/ICSD.2013.6619902
Filename
6619902
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