DocumentCode
3344868
Title
Characterization of high-resistivity polycrystalline silicon substrates for wafer-level packaging and integration of RF passives
Author
Bartek, M. ; Polyakov, A. ; Sinaga, S.M. ; Mendes, P.M. ; Correia, J.H. ; Burghartz, J.N.
fYear
2004
fDate
Oct. 17-21, 2004
Firstpage
227
Lastpage
230
Keywords
Active inductors; Circuits; Coplanar waveguides; Dielectric substrates; Glass; Radio frequency; Silicon; Spirals; Thermal conductivity; Wafer scale integration;
fLanguage
English
Publisher
ieee
Conference_Titel
Advanced Semiconductor Devices and Microsystems, 2004. ASDAM 2004. The Fifth International Conference on
Print_ISBN
0-7803-8335-7
Type
conf
DOI
10.1109/ASDAM.2004.1441202
Filename
1441202
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