DocumentCode :
3344868
Title :
Characterization of high-resistivity polycrystalline silicon substrates for wafer-level packaging and integration of RF passives
Author :
Bartek, M. ; Polyakov, A. ; Sinaga, S.M. ; Mendes, P.M. ; Correia, J.H. ; Burghartz, J.N.
fYear :
2004
fDate :
Oct. 17-21, 2004
Firstpage :
227
Lastpage :
230
Keywords :
Active inductors; Circuits; Coplanar waveguides; Dielectric substrates; Glass; Radio frequency; Silicon; Spirals; Thermal conductivity; Wafer scale integration;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Advanced Semiconductor Devices and Microsystems, 2004. ASDAM 2004. The Fifth International Conference on
Print_ISBN :
0-7803-8335-7
Type :
conf
DOI :
10.1109/ASDAM.2004.1441202
Filename :
1441202
Link To Document :
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