Title :
Optics for Enabling Future HPC Systems
Author :
Shainer, Gilad ; Gutkind, Eyal ; Lee, Bill ; Kagan, Michael ; Kliteynik, Yevgeny
Author_Institution :
Mellanox Technol., Israel
Abstract :
Increasing demand for computing power in scientific and engineering applications has spurred deployment of high-performance computing clusters. According to the TOP500 list, an industry respected report of the most powerful computer systems, the high-performance computing market entered the Teraflop era in 2005 (the entry point on the list became greater than 1 Teraflop) and anticipates entering the Petaflop era in 2015. Future HPC systems that are capable of running large-scale parallel applications will span thousands to tens-of-thousands of nodes; all connected together via high-speed connectivity solutions to form a Peta to multi-Petaflop clusters. There are several architectural approaches to interconnect nodes together to construct an HPC system, such as the use of a fat-tree (CBB) or a 3-D torus. The overall number of communication links grows with the size of the system. The physical medium for those Links have become a growing concern for large-scale platforms, as they tend to impact the system architecture, the system reliability and its cost. In the paper we review the requirements for HPC systems cabling, and in particular optical cables. Optical cables capabilities will become the main limitation for building systems at any scale according to the CPU, memory and interconnect roadmaps in the next few years.
Keywords :
parallel processing; workstation clusters; 3D torus; HPC systems; fat-tree; high-performance computing clusters; optical cables; parallel applications; Application software; Cables; Computer industry; Costs; High speed optical techniques; Large-scale systems; Optical interconnections; Power engineering and energy; Power engineering computing; Reliability; Communications patterns; High Performance Computing; InfiniBand; Networking Architecture; Optical Connectivity;
Conference_Titel :
High Performance Interconnects, 2009. HOTI 2009. 17th IEEE Symposium on
Conference_Location :
New York, NY
Print_ISBN :
978-0-7695-3847-1
Electronic_ISBN :
1550-4794
DOI :
10.1109/HOTI.2009.18