• DocumentCode
    3345192
  • Title

    Integrated pressure sensor - use of microsystems model flow

  • Author

    Husak, M. ; Jakvenko, J. ; Kulha, P. ; Novak, J. ; Janicek, V.

  • fYear
    2004
  • fDate
    17-21 Oct. 2004
  • Firstpage
    299
  • Lastpage
    302
  • Abstract
    The paper describes flow of design software of a simple microsysfem structure for a capacity measurement. The base of structure is capacity pressure circlIi! with integrated inductance on a single Si chip. An integrated one-chip passive microsensor as resonance circuit has been designed and realised The maximum size of the whole integrated circuit can be 3x3 mm. The capacitor area of Ixl mm is chosen. Model system with corresponding software support is utilized jar design. Tools used for the design of integrated structure are described as well. Different models were designed for simulation of the properties of the designed structure. Model of the substitute electronic circuit involves active and parasitic elements. The properties of this eqUivalent model are explored using the SPICE circuit simulator. Mechanical properties of the structure are explored using the CoventorWare program. Distribution of mechanical stress and boundary parameters are the most important ones. Various modifications of integrated structure are designed ond realised.
  • Keywords
    Biomembranes; Capacitive sensors; Circuit simulation; Integrated circuit technology; Microelectronics; Microsensors; RLC circuits; Resonance; SPICE; Software design;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Advanced Semiconductor Devices and Microsystems, 2004. ASDAM 2004. The Fifth International Conference on
  • Conference_Location
    Smolenice Castle, Slovakia
  • Print_ISBN
    0-7803-8335-7
  • Type

    conf

  • DOI
    10.1109/ASDAM.2004.1441220
  • Filename
    1441220