Title :
Which substrate is best for EMI?
Author_Institution :
Motorola AIEG, Stotfold, UK
Abstract :
This paper compares five groups of substrate technologies from an EMI viewpoint. The substrates, which were chosen to represent those in common usage, are: (1) “standard” epoxy types (FR-4, FR-N etc); (2) “flex” substrates; (3) LTCC ceramic substrates; (4) diffusion patterned substrates; and (5) HDI (high density interconnect)
Keywords :
electromagnetic interference; substrates; EMI; LTCC ceramic substrates; diffusion patterned substrates; epoxy substrates; flex substrates; high density interconnect; substrate technologies; Ceramics; Dielectric substrates; Electromagnetic interference; Flexible printed circuits; Impedance; Integrated circuit interconnections; Microprocessors; Microstrip; Plasma temperature; Predictive models;
Conference_Titel :
Electromagnetic Compatibility, 1998. 1998 IEEE International Symposium on
Conference_Location :
Denver, CO
Print_ISBN :
0-7803-5015-4
DOI :
10.1109/ISEMC.1998.750138
