DocumentCode

3345444

Title

Realization of Pb-Free FC-BGA Technology on Low-k Device

Author

Hayashi, Eiji ; Baba, Shinji ; Idaka, Shiori ; Maeda, Akira ; Satoh, Mitsuru ; Kimura, Michitaka

fYear

2005

fDate

May 31 2005-June 3 2005

Firstpage

9

Lastpage

13

Keywords

Aluminum; Assembly; Copper; Dielectric materials; Electronics packaging; Lead; Mechanical factors; Resins; Silver; Testing;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Components and Technology Conference, 2005. Proceedings. 55th

Conference_Location

Lake Buena Vista, FL

ISSN

0569-5503

Print_ISBN

0-7803-8907-7

Type

conf

DOI

10.1109/ECTC.2005.1441237

Filename

1441237