DocumentCode
3345454
Title
Development of 50mm Flipchip Plastic Ball Grid Array Package with Low-K Silicon Technology
Author
Kutlu, Zafer ; Rajagopalan, Sarathy ; Chung, Chaowen
fYear
2005
fDate
May 31 2005-June 3 2005
Firstpage
14
Lastpage
17
Keywords
Circuit testing; Copper; Delamination; Dielectric materials; Dielectric substrates; Electronics packaging; Materials reliability; Plastic packaging; Silicon; Stress;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Components and Technology Conference, 2005. Proceedings. 55th
Conference_Location
Lake Buena Vista, FL
ISSN
0569-5503
Print_ISBN
0-7803-8907-7
Type
conf
DOI
10.1109/ECTC.2005.1441238
Filename
1441238
Link To Document