• DocumentCode
    3345470
  • Title

    Chip Scale Packaging Solution with the Flip-Chip Technologies for CMOS Image Sensor

  • Author

    Jung, Gi-Jo ; Yeo, Young-Woon ; Park, Yun-Mook ; Kang, In-Soo ; Kim, Jong-Heon ; Choi, Jay

  • fYear
    2005
  • fDate
    May 31 2005-June 3 2005
  • Firstpage
    18
  • Lastpage
    22
  • Keywords
    Assembly; CMOS image sensors; CMOS technology; Cameras; Chip scale packaging; Computational Intelligence Society; Image sensors; Optical devices; Optical sensors; Process design;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Components and Technology Conference, 2005. Proceedings. 55th
  • Conference_Location
    Lake Buena Vista, FL
  • ISSN
    0569-5503
  • Print_ISBN
    0-7803-8907-7
  • Type

    conf

  • DOI
    10.1109/ECTC.2005.1441239
  • Filename
    1441239
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=3345470