Title :
Chip Scale Packaging Solution with the Flip-Chip Technologies for CMOS Image Sensor
Author :
Jung, Gi-Jo ; Yeo, Young-Woon ; Park, Yun-Mook ; Kang, In-Soo ; Kim, Jong-Heon ; Choi, Jay
fDate :
May 31 2005-June 3 2005
Keywords :
Assembly; CMOS image sensors; CMOS technology; Cameras; Chip scale packaging; Computational Intelligence Society; Image sensors; Optical devices; Optical sensors; Process design;
Conference_Titel :
Electronic Components and Technology Conference, 2005. Proceedings. 55th
Conference_Location :
Lake Buena Vista, FL
Print_ISBN :
0-7803-8907-7
DOI :
10.1109/ECTC.2005.1441239
