DocumentCode :
3345499
Title :
High I/O Glass Ceramic Package Pb-Free BGA Interconnect Reliability
Author :
Dai, Xiang ; Pan, Ning ; Castro, Alicia ; Culler, Jason ; Hussain, Mumtaz ; Lewis, Russ ; Michalka, Tim
fYear :
2005
fDate :
May 31 2005-June 3 2005
Firstpage :
23
Lastpage :
29
Keywords :
Application software; Assembly; Ceramics; Glass; High performance computing; Integrated circuit interconnections; Packaging; Soldering; Testing; Vehicles;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronic Components and Technology Conference, 2005. Proceedings. 55th
Conference_Location :
Lake Buena Vista, FL
ISSN :
0569-5503
Print_ISBN :
0-7803-8907-7
Type :
conf
DOI :
10.1109/ECTC.2005.1441240
Filename :
1441240
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=3345499
