DocumentCode :
3345540
Title :
Thermo-Mechanical Reliability of High-End Flip Chip BGA Packages: Comparison Heat Spreader and Motherboard Construction
Author :
Kim, Sang Ha ; Park, Han ; Suzuki, Katsunobu
fYear :
2005
fDate :
May 31 2005-June 3 2005
Firstpage :
38
Lastpage :
43
Keywords :
Electronic packaging thermal management; Failure analysis; Fatigue; Flip chip; Immune system; Resistance heating; Soldering; Testing; Thermal resistance; Thermomechanical processes;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronic Components and Technology Conference, 2005. Proceedings. 55th
Conference_Location :
Lake Buena Vista, FL
ISSN :
0569-5503
Print_ISBN :
0-7803-8907-7
Type :
conf
DOI :
10.1109/ECTC.2005.1441242
Filename :
1441242
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=3345540
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