DocumentCode :
3345607
Title :
Study on Thermal Interface Material with Carbon Nanotubes and Carbon Black in High-Brightness LED Packaging with Flip-Chip
Author :
Zhang, Kai ; Xiao, Guo-Wei ; Wong, Cell K Y ; Gu, Hong-Wei ; Yuen, Matthew M F ; Chan, Philip C.H. ; Xu, Bing
fYear :
2005
fDate :
May 31 2005-June 3 2005
Firstpage :
60
Lastpage :
65
Keywords :
Bonding; Carbon nanotubes; Chemical technology; Conducting materials; Electronic packaging thermal management; Epoxy resins; Light emitting diodes; Organic materials; Temperature; Thermal conductivity;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronic Components and Technology Conference, 2005. Proceedings. 55th
Conference_Location :
Lake Buena Vista, FL
ISSN :
0569-5503
Print_ISBN :
0-7803-8907-7
Type :
conf
DOI :
10.1109/ECTC.2005.1441246
Filename :
1441246
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=3345607
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