Flexible circuit creation with nano metal particles

Low cost and reliable printing technologies are more and more attractive to flexible electronic industries for replacing traditional subtractive etched Cu in circuit creations. In this paper, nano metal particle (NMP) Ag traces are compared with conductive lithograph film (CLF) Ag, thick film (TF) Ag, TF Cu traces, and traditional etched (etched) Cu with regard to trace resolution, surface quality, microstructure, and electrical conductivity. The results show that, next to etched Cu, the NMP Ag traces have the smoothest surface, highest resolution, densest structure, and highest conductivity. The advantages and disadvantages of NMP Ag traces are discussed from the perspective of metallurgical process of sintering and microstructure. Suggestions are given for further improvement of the nano metal particle circuitry technology.