DocumentCode
3345689
Title
Effect of Intermetallics Spalling on the Mechanical Behavior of Electroless Ni(P)/Pb-Free Solder Interconnection
Author
Sohn, Yoon-Chul ; Yu, Jin ; Kang, Sung K. ; Shih, Da-Yuan ; Lee, Taek-Yeong
fYear
2005
fDate
May 31 2005-June 3 2005
Firstpage
83
Lastpage
88
Keywords
Gold; Integrated circuit interconnections; Intermetallic; Metallization; Printed circuits; Soldering; Surface cracks; Surface finishing; Testing; Tin;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Components and Technology Conference, 2005. Proceedings. 55th
Conference_Location
Lake Buena Vista, FL
ISSN
0569-5503
Print_ISBN
0-7803-8907-7
Type
conf
DOI
10.1109/ECTC.2005.1441250
Filename
1441250
Link To Document