Optimization of Copper Column Based Solder Bump Design for High Reliability Flip-Chip Interconnections

Author

Yamada, Hiroshi ; Togasaki, Takashi

fYear

2005

fDate

May 31 2005-June 3 2005

Firstpage

Lastpage

Keywords

Analytical models; Capacitive sensors; Copper; Design optimization; Encapsulation; Large scale integration; Plastics; Resins; Stress; Temperature;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Components and Technology Conference, 2005. Proceedings. 55th

Conference_Location

Lake Buena Vista, FL

ISSN

0569-5503

Print_ISBN

0-7803-8907-7

Type

DOI

10.1109/ECTC.2005.1441252

Filename

1441252

Link To Document