Title :
Optimization of Copper Column Based Solder Bump Design for High Reliability Flip-Chip Interconnections
Author :
Yamada, Hiroshi ; Togasaki, Takashi
fDate :
May 31 2005-June 3 2005
Keywords :
Analytical models; Capacitive sensors; Copper; Design optimization; Encapsulation; Large scale integration; Plastics; Resins; Stress; Temperature;
Conference_Titel :
Electronic Components and Technology Conference, 2005. Proceedings. 55th
Conference_Location :
Lake Buena Vista, FL
Print_ISBN :
0-7803-8907-7
DOI :
10.1109/ECTC.2005.1441252
