DocumentCode :
3345812
Title :
Decision-Support Models for Thermo-Mechanical Reliability of Leadfree Flip-Chip Electronics in Extreme Environments
Author :
Lall, Pradeep ; Singh, Naveen ; Strickland, Mark ; Blanche, Jim ; Suhling, Jeff
fYear :
2005
fDate :
May 31 2005-June 3 2005
Firstpage :
127
Lastpage :
136
Keywords :
Aerospace electronics; Components, packaging, and manufacturing technology; Electronic packaging thermal management; Electronics packaging; Flip chip; Geometry; Materials reliability; Predictive models; Product design; Thermomechanical processes;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronic Components and Technology Conference, 2005. Proceedings. 55th
Conference_Location :
Lake Buena Vista, FL
ISSN :
0569-5503
Print_ISBN :
0-7803-8907-7
Type :
conf
DOI :
10.1109/ECTC.2005.1441257
Filename :
1441257
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=3345812
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