• DocumentCode
    3345910
  • Title

    Multi-Physics Based Structural Similarity Rules for the BGA Package Family

  • Author

    van Driel, W.D. ; Mavinkurve, A. ; van Gils, M.A.J. ; Zhang, G.Q. ; Yang, D.G. ; Ernst, L.J.

  • fYear
    2005
  • fDate
    May 31 2005-June 3 2005
  • Firstpage
    165
  • Lastpage
    171
  • Keywords
    Costs; Fabrication; Integrated circuit packaging; Integrated circuit reliability; Lead; Physics; Process design; Qualifications; Semiconductor device packaging; Testing;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Components and Technology Conference, 2005. Proceedings. 55th
  • Conference_Location
    Lake Buena Vista, FL
  • ISSN
    0569-5503
  • Print_ISBN
    0-7803-8907-7
  • Type

    conf

  • DOI
    10.1109/ECTC.2005.1441262
  • Filename
    1441262
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=3345910