DocumentCode :
3345941
Title :
Photo-Definable Nanocomposite for Wafer Level Packaging
Author :
Sun, Yangyang ; Zhang, Zhuqing ; Wong, C.P.
fYear :
2005
fDate :
May 31 2005-June 3 2005
Firstpage :
179
Lastpage :
184
Keywords :
Chemical industry; Curing; Epoxy resins; Materials science and technology; Mechanical factors; Polymers; Resists; Silicon compounds; Thermal stresses; Wafer scale integration;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronic Components and Technology Conference, 2005. Proceedings. 55th
Conference_Location :
Lake Buena Vista, FL
ISSN :
0569-5503
Print_ISBN :
0-7803-8907-7
Type :
conf
DOI :
10.1109/ECTC.2005.1441264
Filename :
1441264
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=3345941
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