DocumentCode
3345941
Title
Photo-Definable Nanocomposite for Wafer Level Packaging
Author
Sun, Yangyang ; Zhang, Zhuqing ; Wong, C.P.
fYear
2005
fDate
May 31 2005-June 3 2005
Firstpage
179
Lastpage
184
Keywords
Chemical industry; Curing; Epoxy resins; Materials science and technology; Mechanical factors; Polymers; Resists; Silicon compounds; Thermal stresses; Wafer scale integration;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Components and Technology Conference, 2005. Proceedings. 55th
Conference_Location
Lake Buena Vista, FL
ISSN
0569-5503
Print_ISBN
0-7803-8907-7
Type
conf
DOI
10.1109/ECTC.2005.1441264
Filename
1441264
Link To Document