Methods of underfill flow voids detection and minimization in flip chip package

Author

Wang, Jinlin ; Hsu, Marcus ; Dunaway, Patrick ; He, Dongming ; Buckmann, Ken

Author_Institution

Intel Corp., Chandler, AZ, USA

fYear

2005

fDate

31 May-3 June 2005

Firstpage

190

Abstract

Rheological properties of underfills were measured at dispensing temperatures. The surface energy of different substrates and wetting angles of underfills on the substrates were also measured and showed differences between different substrates. It was observed that the viscosity of an underfill and substrate wetting have a strong impact on the formation of flow voids. A video underfill flow metrology was developed for flow void observation. The correlation between underfill, substrate properties, and flow voids formation based on. the video flow metrology measurement will be discussed. We will also discuss how to optimize the underfill and substrate properties to minimize the flow voids.

Keywords

chip-on-board packaging; flip-chip devices; minimisation; rheology; signal processing; soldering; substrates; viscosity; voids (solid); wetting; flip chip package; flow voids formation; rheological properties; substrate properties; substrate wetting; surface energy; underfill flow metrology; underfill flow voids detection; underfill viscosity of; video flow metrology measurement; voids minimization; Energy measurement; Flip chip; Fluid flow measurement; Metrology; Minimization methods; Packaging; Rheology; Semiconductor device measurement; Temperature measurement; Viscosity;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Components and Technology Conference, 2005. Proceedings. 55th

ISSN

0569-5503

Print_ISBN

0-7803-8907-7

Type

conf

DOI

10.1109/ECTC.2005.1441266

Filename

1441266