DocumentCode :
3346013
Title :
Nano-Underfills for High-Reliability Applications in Extreme Environments
Author :
Lall, Pradeep ; Islam, Saiful ; Suhling, Jeff ; Tian, Guoyun
fYear :
2005
fDate :
May 31 2005-June 3 2005
Firstpage :
212
Lastpage :
222
Keywords :
Chip scale packaging; Electronic packaging thermal management; Integrated circuit interconnections; Mechanical engineering; Predictive models; Silicon compounds; Temperature dependence; Temperature distribution; Thermal expansion; Thermomechanical processes;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronic Components and Technology Conference, 2005. Proceedings. 55th
Conference_Location :
Lake Buena Vista, FL
ISSN :
0569-5503
Print_ISBN :
0-7803-8907-7
Type :
conf
DOI :
10.1109/ECTC.2005.1441269
Filename :
1441269
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=3346013
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