• DocumentCode
    3346063
  • Title

    Direct integration of dense parallel optical interconnects on a first level package for high-end servers

  • Author

    Colgan, Evan G. ; Furman, Bruce ; Magerlein, J.H. ; Schaub, Jeremy ; Schow, Clint ; Stigliani, Dan, Jr. ; Torok, John ; Benner, Alan ; Becker, Dale ; Katopis, George ; Abshier, John ; Dyckman, Warren ; Lemoff, Brian E. ; Ali, Mohammed E. ; Panotopoulos, G

  • Author_Institution
    IBM T.J. Watson Res. Center, Yorktown Heights, NY, USA
  • fYear
    2005
  • fDate
    31 May-3 June 2005
  • Firstpage
    228
  • Abstract
    The direct integration of dense 48-channel parallel multiwavelength optical transmitter and receiver subassemblies directly onto a first level package using a flex lead attach has been demonstrated. Such an approach, at 10 Gb/s/channel would provide a linear edge bandwidth density of 300 Gb/s/cm. By attaching dense multichannel optical subassemblies directly onto an MCM, the performance limitations of the connectors and node card wiring can be avoided and the total bandwidth off the MCM can be increased while also enabling longer distance and higher speed signaling. This approach involves only a modest modification to the bent-flex approach commonly used for parallel optical modules intended for board mounting but enables a significant density and performance improvement for this application.
  • Keywords
    assembling; integrated circuit interconnections; multichip modules; optical interconnections; optical receivers; optical transmitters; surface mount technology; MCM; bent-flex approach; board mounting; first level package; flex lead attach; high-end servers; multichannel optical subassemblies; optical receiver; optical transmitter; parallel optical interconnects; parallel optical modules; Bandwidth; Connectors; Contacts; Joining processes; Laboratories; Optical interconnections; Optical receivers; Optical transmitters; Packaging; Wiring;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Components and Technology Conference, 2005. Proceedings. 55th
  • ISSN
    0569-5503
  • Print_ISBN
    0-7803-8907-7
  • Type

    conf

  • DOI
    10.1109/ECTC.2005.1441271
  • Filename
    1441271