DocumentCode :
3346063
Title :
Direct integration of dense parallel optical interconnects on a first level package for high-end servers
Author :
Colgan, Evan G. ; Furman, Bruce ; Magerlein, J.H. ; Schaub, Jeremy ; Schow, Clint ; Stigliani, Dan, Jr. ; Torok, John ; Benner, Alan ; Becker, Dale ; Katopis, George ; Abshier, John ; Dyckman, Warren ; Lemoff, Brian E. ; Ali, Mohammed E. ; Panotopoulos, G
Author_Institution :
IBM T.J. Watson Res. Center, Yorktown Heights, NY, USA
fYear :
2005
fDate :
31 May-3 June 2005
Firstpage :
228
Abstract :
The direct integration of dense 48-channel parallel multiwavelength optical transmitter and receiver subassemblies directly onto a first level package using a flex lead attach has been demonstrated. Such an approach, at 10 Gb/s/channel would provide a linear edge bandwidth density of 300 Gb/s/cm. By attaching dense multichannel optical subassemblies directly onto an MCM, the performance limitations of the connectors and node card wiring can be avoided and the total bandwidth off the MCM can be increased while also enabling longer distance and higher speed signaling. This approach involves only a modest modification to the bent-flex approach commonly used for parallel optical modules intended for board mounting but enables a significant density and performance improvement for this application.
Keywords :
assembling; integrated circuit interconnections; multichip modules; optical interconnections; optical receivers; optical transmitters; surface mount technology; MCM; bent-flex approach; board mounting; first level package; flex lead attach; high-end servers; multichannel optical subassemblies; optical receiver; optical transmitter; parallel optical interconnects; parallel optical modules; Bandwidth; Connectors; Contacts; Joining processes; Laboratories; Optical interconnections; Optical receivers; Optical transmitters; Packaging; Wiring;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronic Components and Technology Conference, 2005. Proceedings. 55th
ISSN :
0569-5503
Print_ISBN :
0-7803-8907-7
Type :
conf
DOI :
10.1109/ECTC.2005.1441271
Filename :
1441271
Link To Document :
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