DocumentCode :
3346220
Title :
Signal Integrity and Power Integrity Properties of FCBGA Based on Ultra-Thin, High-Density Packaging Substrate
Author :
Sakai, Jun ; Shimoto, Tadanori ; Nakase, Koichiro ; Inoue, Hirobumi ; Motonaga, Kazuhiro ; Honda, Hirokazu
fYear :
2005
fDate :
May 31 2005-June 3 2005
Firstpage :
284
Lastpage :
290
Keywords :
Application specific integrated circuits; Dielectric substrates; Electronics packaging; Fabrication; Flowcharts; Frequency; Laminates; Large scale integration; National electric code; Wiring;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronic Components and Technology Conference, 2005. Proceedings. 55th
Conference_Location :
Lake Buena Vista, FL
ISSN :
0569-5503
Print_ISBN :
0-7803-8907-7
Type :
conf
DOI :
10.1109/ECTC.2005.1441280
Filename :
1441280
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=3346220
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