Title :
Development of a small die-small form factor flip chip package for application in LAN products
Author :
Hasan, Altaf ; Robertson, Glenn ; Mensah, Kofi ; Molina, Al
fDate :
May 31 2005-June 3 2005
Keywords :
Assembly; Bonding; CMOS technology; Ethernet networks; Flip chip; Lead; Local area networks; Packaging; Signal processing; Space technology;
Conference_Titel :
Electronic Components and Technology Conference, 2005. Proceedings. 55th
Conference_Location :
Lake Buena Vista, FL
Print_ISBN :
0-7803-8907-7
DOI :
10.1109/ECTC.2005.1441283
