DocumentCode :
3346383
Title :
High Aspect Ratio Through-Wafer Interconnect for Three Dimensional Integrated Circuits
Author :
Ranganathan, N. ; Prasad, K. ; Balasubramanian, N. ; Qiaoer, Zhou ; Hwee, Seah Chin
fYear :
2005
fDate :
May 31 2005-June 3 2005
Firstpage :
343
Lastpage :
348
Keywords :
Copper; Electronic components; Etching; Integrated circuit interconnections; Integrated circuit technology; Microelectronics; Power system interconnection; Silicon; Ultra large scale integration; Wafer bonding;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronic Components and Technology Conference, 2005. Proceedings. 55th
Conference_Location :
Lake Buena Vista, FL
ISSN :
0569-5503
Print_ISBN :
0-7803-8907-7
Type :
conf
DOI :
10.1109/ECTC.2005.1441289
Filename :
1441289
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=3346383
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