• DocumentCode
    3346383
  • Title

    High Aspect Ratio Through-Wafer Interconnect for Three Dimensional Integrated Circuits

  • Author

    Ranganathan, N. ; Prasad, K. ; Balasubramanian, N. ; Qiaoer, Zhou ; Hwee, Seah Chin

  • fYear
    2005
  • fDate
    May 31 2005-June 3 2005
  • Firstpage
    343
  • Lastpage
    348
  • Keywords
    Copper; Electronic components; Etching; Integrated circuit interconnections; Integrated circuit technology; Microelectronics; Power system interconnection; Silicon; Ultra large scale integration; Wafer bonding;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Components and Technology Conference, 2005. Proceedings. 55th
  • Conference_Location
    Lake Buena Vista, FL
  • ISSN
    0569-5503
  • Print_ISBN
    0-7803-8907-7
  • Type

    conf

  • DOI
    10.1109/ECTC.2005.1441289
  • Filename
    1441289
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=3346383