Finite element analysis of lead-free drop test boards

Author

Marjamäki, Pekka ; Mattila, Toni ; Kivilahti, Jorma

Author_Institution

Lab. of Electron. Production Technol., Helsinki Univ. of Technol., Finland

fYear

2005

fDate

31 May-3 June 2005

Firstpage

462

Abstract

Lead-free CSP assemblies were drop tested according to the JEDEC standard (JESD-B111) and the finite element analysis of the test assembly was carried out to simulate the strain and stress distributions generated in the assemblies. The vibration of the board during the test was measured with strain gauges and the results were compared to the FE model predictions. The eigenfrequency analysis was executed to determine the mechanical properties of the assemblies under very fast deformations and the results were used to improve the FE model. The calculated strains correspond well with the measured ones and there was good correlation between the calculated stresses and the observed failure modes.

Keywords

chip scale packaging; circuit reliability; eigenvalues and eigenfunctions; electronics packaging; finite element analysis; impact testing; printed circuit testing; standards; vibration measurement; JEDEC standard; JESD-B111; board vibration measurement; eigenfrequency analysis; finite element analysis; lead-free CSP assemblies; lead-free drop test boards; strain distribution simulation; strain gauges; stress distribution simulation; Analytical models; Assembly; Capacitive sensors; Environmentally friendly manufacturing techniques; Finite element methods; Lead; Strain measurement; Stress; Testing; Vibration measurement;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Components and Technology Conference, 2005. Proceedings. 55th

ISSN

0569-5503

Print_ISBN

0-7803-8907-7

Type

conf

DOI

10.1109/ECTC.2005.1441306

Filename

1441306