• DocumentCode
    3346778
  • Title

    Parametric Investigation of Dynamic Behavior of FBGA Solder Joints in Board-Level Drop Simulation

  • Author

    Groothuis, Steve ; Chen, Changming ; Kovacevic, Radovan

  • fYear
    2005
  • fDate
    May 31 2005-June 3 2005
  • Firstpage
    499
  • Lastpage
    503
  • Keywords
    Chip scale packaging; Circuit testing; Design optimization; Electric shock; Electronics packaging; Life estimation; Soldering; Solid modeling; Strain measurement; Thermal stresses;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Components and Technology Conference, 2005. Proceedings. 55th
  • Conference_Location
    Lake Buena Vista, FL
  • ISSN
    0569-5503
  • Print_ISBN
    0-7803-8907-7
  • Type

    conf

  • DOI
    10.1109/ECTC.2005.1441311
  • Filename
    1441311
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=3346778