DocumentCode :
3346810
Title :
Embedded RF Balun for 3D System-in-Package Solutions
Author :
Mäntysalo, Matti ; Ristolainen, Eero O.
fYear :
2005
fDate :
May 31 2005-June 3 2005
Firstpage :
513
Lastpage :
517
Keywords :
Consumer electronics; Electromagnetic coupling; Electromagnetic measurements; Electronics packaging; Impedance matching; Integrated circuit interconnections; Manufacturing; Radio frequency; Semiconductor device packaging; Wireless communication;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronic Components and Technology Conference, 2005. Proceedings. 55th
Conference_Location :
Lake Buena Vista, FL
ISSN :
0569-5503
Print_ISBN :
0-7803-8907-7
Type :
conf
DOI :
10.1109/ECTC.2005.1441313
Filename :
1441313
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=3346810
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