Title :
Microsystem packaging of an RF SAW correlator
Author :
Brocato, Robert W. ; Studor, George F. ; Palmer, David W.
Author_Institution :
Sandia Nat. Labs., Albuquerque, NM, USA
fDate :
31 May-3 June 2005
Abstract :
An electrically programmable surface acoustic wave (SAW) correlator was recently completed from design through small scale production in support of low power space-based communications for NASA. Three different versions of this RF microsystem were built to satisfy design requirements and overcome packaging and system reliability related issues. Flip-chip packaging and conventional thick film hybrid assembly techniques are compared in the fabrication of this microsystem.
Keywords :
correlators; flip-chip devices; surface acoustic wave correlation; RF SAW correlator; RF microsystem; flip-chip packaging; microsystem packaging; space-based communication; surface acoustic wave correlator; thick film hybrid assembly technique; Acoustic waves; Assembly; Correlators; NASA; Packaging; Production; Radio frequency; Reliability; Surface acoustic waves; Thick films;
Conference_Titel :
Electronic Components and Technology Conference, 2005. Proceedings. 55th
Print_ISBN :
0-7803-8907-7
DOI :
10.1109/ECTC.2005.1441314
