Microsystem packaging of an RF SAW correlator

Author

Brocato, Robert W. ; Studor, George F. ; Palmer, David W.

Author_Institution

Sandia Nat. Labs., Albuquerque, NM, USA

fYear

2005

fDate

31 May-3 June 2005

Firstpage

518

Abstract

An electrically programmable surface acoustic wave (SAW) correlator was recently completed from design through small scale production in support of low power space-based communications for NASA. Three different versions of this RF microsystem were built to satisfy design requirements and overcome packaging and system reliability related issues. Flip-chip packaging and conventional thick film hybrid assembly techniques are compared in the fabrication of this microsystem.

Keywords

correlators; flip-chip devices; surface acoustic wave correlation; RF SAW correlator; RF microsystem; flip-chip packaging; microsystem packaging; space-based communication; surface acoustic wave correlator; thick film hybrid assembly technique; Acoustic waves; Assembly; Correlators; NASA; Packaging; Production; Radio frequency; Reliability; Surface acoustic waves; Thick films;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Components and Technology Conference, 2005. Proceedings. 55th

ISSN

0569-5503

Print_ISBN

0-7803-8907-7

Type

conf

DOI

10.1109/ECTC.2005.1441314

Filename

1441314

Link To Document

https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=3346825