DocumentCode :
3346904
Title :
A Stacked-Chip Package Optimized Design for a High Sensitivity GPS Application
Author :
Ding, Hanyi ; Koeller, Jeffrey ; Maloney, J.J.
fYear :
2005
fDate :
May 31 2005-June 3 2005
Firstpage :
536
Lastpage :
540
Keywords :
Design optimization; Digital integrated circuits; Digital signal processing; Global Positioning System; Integrated circuit packaging; Laminates; Microassembly; Radio frequency; Radiofrequency integrated circuits; Signal detection;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronic Components and Technology Conference, 2005. Proceedings. 55th
Conference_Location :
Lake Buena Vista, FL
ISSN :
0569-5503
Print_ISBN :
0-7803-8907-7
Type :
conf
DOI :
10.1109/ECTC.2005.1441318
Filename :
1441318
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=3346904
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