• DocumentCode
    3346904
  • Title

    A Stacked-Chip Package Optimized Design for a High Sensitivity GPS Application

  • Author

    Ding, Hanyi ; Koeller, Jeffrey ; Maloney, J.J.

  • fYear
    2005
  • fDate
    May 31 2005-June 3 2005
  • Firstpage
    536
  • Lastpage
    540
  • Keywords
    Design optimization; Digital integrated circuits; Digital signal processing; Global Positioning System; Integrated circuit packaging; Laminates; Microassembly; Radio frequency; Radiofrequency integrated circuits; Signal detection;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Components and Technology Conference, 2005. Proceedings. 55th
  • Conference_Location
    Lake Buena Vista, FL
  • ISSN
    0569-5503
  • Print_ISBN
    0-7803-8907-7
  • Type

    conf

  • DOI
    10.1109/ECTC.2005.1441318
  • Filename
    1441318
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=3346904