DocumentCode
3347016
Title
Laser Closing of Window as a Novel Wafer-Level Hermetic Packaging Technology
Author
Cheung, K.P. ; Wang, Y. ; Pai, C.S.
fYear
2005
fDate
May 31 2005-June 3 2005
Firstpage
566
Lastpage
571
Keywords
CMOS technology; Chemical technology; Costs; Encapsulation; Microelectromechanical devices; Micromechanical devices; Packaging; Protection; Temperature; Wafer scale integration;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Components and Technology Conference, 2005. Proceedings. 55th
Conference_Location
Lake Buena Vista, FL
ISSN
0569-5503
Print_ISBN
0-7803-8907-7
Type
conf
DOI
10.1109/ECTC.2005.1441324
Filename
1441324
Link To Document