DocumentCode :
3347023
Title :
Wafer Process Chip Size Package Consisting of Double-Bump Structure for Small-Pin-Count Packages
Author :
Mitsuka, Kaoru ; Kurata, Hiroyuki ; Furukawa, Jun ; Takahashi, Michiya
fYear :
2005
fDate :
May 31 2005-June 3 2005
Firstpage :
572
Lastpage :
576
Keywords :
Aluminum; Bonding; Coatings; Electronic packaging thermal management; Electronics packaging; Materials reliability; Nickel; Resins; Semiconductor device packaging; Wafer scale integration;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronic Components and Technology Conference, 2005. Proceedings. 55th
Conference_Location :
Lake Buena Vista, FL
ISSN :
0569-5503
Print_ISBN :
0-7803-8907-7
Type :
conf
DOI :
10.1109/ECTC.2005.1441325
Filename :
1441325
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=3347023
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