مرکز منطقه ای اطلاع رساني علوم و فناوري

DocumentCode :

3347040

Title :

Design and Development of True-CSP

Author :

Kanth, Kolan Ravi ; Poh, Francis K S ; Lim, B.K. ; Chong, Desmond Y R ; Sun, Anthony ; Tan, H.B.

fYear :

2005

fDate :

May 31 2005-June 3 2005

Firstpage :

577

Lastpage :

582

Keywords :

Assembly; Chip scale packaging; Copper; Encapsulation; Printing; Silicon; Stress; Strips; Testing; Wafer scale integration;

fLanguage :

English

Publisher :

ieee

Conference_Titel :

Electronic Components and Technology Conference, 2005. Proceedings. 55th

Conference_Location :

Lake Buena Vista, FL

ISSN :

0569-5503

Print_ISBN :

0-7803-8907-7

Type :

conf

DOI :

10.1109/ECTC.2005.1441326

Filename :

1441326

Link To Document :