DocumentCode

3347040

Title

Design and Development of True-CSP

Author

Kanth, Kolan Ravi ; Poh, Francis K S ; Lim, B.K. ; Chong, Desmond Y R ; Sun, Anthony ; Tan, H.B.

fYear

2005

fDate

May 31 2005-June 3 2005

Firstpage

577

Lastpage

582

Keywords

Assembly; Chip scale packaging; Copper; Encapsulation; Printing; Silicon; Stress; Strips; Testing; Wafer scale integration;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Components and Technology Conference, 2005. Proceedings. 55th

Conference_Location

Lake Buena Vista, FL

ISSN

0569-5503

Print_ISBN

0-7803-8907-7

Type

conf

DOI

10.1109/ECTC.2005.1441326

Filename

1441326