• DocumentCode
    3347202
  • Title

    Drop Impact Reliability Testing for Lead-Free and Leaded Soldered IC Packages

  • Author

    Chong, Desmond Y R ; Ng, Kellin ; Tan, Jane Y N ; Low, Patrick T H ; Pang, John H L ; Che, F.X. ; Xiong, B.S. ; Xu, Luhua

  • fYear
    2005
  • fDate
    May 31 2005-June 3 2005
  • Firstpage
    622
  • Lastpage
    629
  • Keywords
    Assembly; Circuit testing; Electronics packaging; Environmentally friendly manufacturing techniques; Integrated circuit packaging; Integrated circuit testing; Intermetallic; Lead; Soldering; Surface finishing;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Components and Technology Conference, 2005. Proceedings. 55th
  • Conference_Location
    Lake Buena Vista, FL
  • ISSN
    0569-5503
  • Print_ISBN
    0-7803-8907-7
  • Type

    conf

  • DOI
    10.1109/ECTC.2005.1441334
  • Filename
    1441334
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=3347202