Modal and impact analysis of modern portable electronic products

Author

Tan, L.B. ; Ang, C.W. ; Lim, C.T. ; Tan, V.B.C. ; Zhang, Xiaowu

Author_Institution

Dept. of Mech. Eng., Nat. Univ. of Singapore, Kent Ridge, Singapore

fYear

2005

fDate

31 May-3 June 2005

Firstpage

645

Abstract

Drop impact responses of various modern cell-phones and portable digital assistants (PDAs) are analyzed in terms of the impact forces and accelerations and strains induced on the printed circuit boards (PCBs). The severity of impact induced on the interior PCBs and their electronic components can be determined from product-level drop tests. The results complement board level tests designed to simulate actual drop conditions experienced by PCBs within the portable products. This paper reports impact performances of recent portable products such as handphones from Samsung, Panasonic and Nokia as well as PDAs from Compaq and Sony. This is a continuation of the research done by Lim et al, 2003.

Keywords

consumer electronics; impact testing; life testing; modal analysis; printed circuit testing; drop impact response; impact analysis; impact forces; modal analysis; portable electronic products; printed circuit boards; strains; Acceleration; Accelerometers; Cameras; Capacitive sensors; Circuit testing; Electronic components; Electronic equipment testing; Integrated circuit packaging; Personal digital assistants; Transducers;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Components and Technology Conference, 2005. Proceedings. 55th

ISSN

0569-5503

Print_ISBN

0-7803-8907-7

Type

conf

DOI

10.1109/ECTC.2005.1441337

Filename

1441337