DocumentCode

3347335

Title

Intermetallic Growth and Failure Study for Sn-Ag-Cu/ENIG PBGA Solder Joints Subject to Thermal Cycling

Author

Xu, Luhua ; Pang, John H L ; Che, F.X.

fYear

2005

fDate

May 31 2005-June 3 2005

Firstpage

682

Lastpage

686

Keywords

Aging; Electric shock; Environmentally friendly manufacturing techniques; Gold; Intermetallic; Isothermal processes; Lead; Nickel; Soldering; Thermal stresses;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Components and Technology Conference, 2005. Proceedings. 55th

Conference_Location

Lake Buena Vista, FL

ISSN

0569-5503

Print_ISBN

0-7803-8907-7

Type

conf

DOI

10.1109/ECTC.2005.1441342

Filename

1441342