DocumentCode

3347371

Title

The Bonding of Sn-Zn-Ag-Al-Ga Lead-Free Solder Balls on Cu/Ni-P/Au BGA Substrate

Author

Lin, Kwang-Lung ; Chiu, Ying-Ta

fYear

2005

fDate

May 31 2005-June 3 2005

Firstpage

692

Lastpage

695

Keywords

Aging; Bonding; Environmentally friendly manufacturing techniques; Gold; Lead; Probes; Scanning electron microscopy; Soldering; Temperature; Testing;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Components and Technology Conference, 2005. Proceedings. 55th

Conference_Location

Lake Buena Vista, FL

ISSN

0569-5503

Print_ISBN

0-7803-8907-7

Type

conf

DOI

10.1109/ECTC.2005.1441344

Filename

1441344