• DocumentCode
    3347415
  • Title

    Development of Flux-Free Reflow Soldering Process Using Hydrogen Radicals

  • Author

    Suenaga, Makoto ; Nakamori, Takashi ; Hirakawa, Daisuke ; Ohno, Yasuhide ; Hagihara, Taizo ; Kagami, Johji ; Takeuchi, Tatsuya

  • fYear
    2005
  • fDate
    May 31 2005-June 3 2005
  • Firstpage
    710
  • Lastpage
    715
  • Keywords
    Bonding; Chip scale packaging; Cleaning; Environmentally friendly manufacturing techniques; Flip chip; Gold; Hydrogen; Reflow soldering; Substrates; Tin;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Components and Technology Conference, 2005. Proceedings. 55th
  • Conference_Location
    Lake Buena Vista, FL
  • ISSN
    0569-5503
  • Print_ISBN
    0-7803-8907-7
  • Type

    conf

  • DOI
    10.1109/ECTC.2005.1441347
  • Filename
    1441347
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=3347415