DocumentCode
3347718
Title
Technology Requirements for Chip-On-Chip Packaging Solutions
Author
Töpper, M. ; Fritzsch, Th. ; Glaw, V. ; Jordan, R. ; Lopper, Ch ; Röder, J. ; Dietrich, L. ; Lutz, M. ; Oppermann, H. ; Ehrmann, O. ; Reichl, Herbert
fYear
2005
fDate
May 31 2005-June 3 2005
Firstpage
802
Lastpage
808
Keywords
Chip scale packaging; Costs; Economic forecasting; Electronics packaging; Flip chip; Microelectronics; Plastic packaging; Stacking; Wafer scale integration; Wiring;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Components and Technology Conference, 2005. Proceedings. 55th
Conference_Location
Lake Buena Vista, FL
ISSN
0569-5503
Print_ISBN
0-7803-8907-7
Type
conf
DOI
10.1109/ECTC.2005.1441364
Filename
1441364
Link To Document