DocumentCode :
3347718
Title :
Technology Requirements for Chip-On-Chip Packaging Solutions
Author :
Töpper, M. ; Fritzsch, Th. ; Glaw, V. ; Jordan, R. ; Lopper, Ch ; Röder, J. ; Dietrich, L. ; Lutz, M. ; Oppermann, H. ; Ehrmann, O. ; Reichl, Herbert
fYear :
2005
fDate :
May 31 2005-June 3 2005
Firstpage :
802
Lastpage :
808
Keywords :
Chip scale packaging; Costs; Economic forecasting; Electronics packaging; Flip chip; Microelectronics; Plastic packaging; Stacking; Wafer scale integration; Wiring;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronic Components and Technology Conference, 2005. Proceedings. 55th
Conference_Location :
Lake Buena Vista, FL
ISSN :
0569-5503
Print_ISBN :
0-7803-8907-7
Type :
conf
DOI :
10.1109/ECTC.2005.1441364
Filename :
1441364
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=3347718
