High thermal performance FBGA MCP with a silicon spacer

This paper presents the high thermal performance FBGA MCP (2 chips) using a silicon spacer. When many devices are integrated in a package, they consume much power and raise the junction temperature, so it is important for the package to have high thermal performance. Hence, we designed and developed a high thermal performance FBGA MCP with a silicon spacer that makes additional heat paths. With the silicon spacer, the thermal resistance of junction to ambient is improved by about 15% and the junction to junction is reduced by about 50%. To guarantee the package reliability of the package with the silicon spacer, we performed the reliability test in JEDEC level 3 condition and the package passed the test. The electrical reliability of the package was verified by measuring the diode voltage of the thermal test chip.