DocumentCode :
3347801
Title :
Thermal and Crosstalk-Aware Physical Design for 3D System-On-Package
Author :
Minz, Jacob ; Wong, Eric ; Lim, Sung Kyu
fYear :
2005
fDate :
May 31 2005-June 3 2005
Firstpage :
824
Lastpage :
831
Keywords :
Algorithm design and analysis; Analog integrated circuits; Crosstalk; Digital integrated circuits; Optical sensors; Packaging; Radio frequency; Radiofrequency integrated circuits; Routing; System-on-a-chip;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronic Components and Technology Conference, 2005. Proceedings. 55th
Conference_Location :
Lake Buena Vista, FL
ISSN :
0569-5503
Print_ISBN :
0-7803-8907-7
Type :
conf
DOI :
10.1109/ECTC.2005.1441368
Filename :
1441368
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=3347801
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