• DocumentCode
    3347801
  • Title

    Thermal and Crosstalk-Aware Physical Design for 3D System-On-Package

  • Author

    Minz, Jacob ; Wong, Eric ; Lim, Sung Kyu

  • fYear
    2005
  • fDate
    May 31 2005-June 3 2005
  • Firstpage
    824
  • Lastpage
    831
  • Keywords
    Algorithm design and analysis; Analog integrated circuits; Crosstalk; Digital integrated circuits; Optical sensors; Packaging; Radio frequency; Radiofrequency integrated circuits; Routing; System-on-a-chip;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Components and Technology Conference, 2005. Proceedings. 55th
  • Conference_Location
    Lake Buena Vista, FL
  • ISSN
    0569-5503
  • Print_ISBN
    0-7803-8907-7
  • Type

    conf

  • DOI
    10.1109/ECTC.2005.1441368
  • Filename
    1441368
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=3347801