• DocumentCode
    3348141
  • Title

    Effect of Reflow Profiles on the Board Level Drop Reliability of Pb-Free (SnAgCu) BGA Assemblies

  • Author

    Lal, Anand ; Bradley, Edwin ; Sharda, Jignesh

  • fYear
    2005
  • fDate
    May 31 2005-June 3 2005
  • Firstpage
    945
  • Lastpage
    953
  • Keywords
    Assembly; Electronics packaging; Environmentally friendly manufacturing techniques; Gold; Intermetallic; Lead; Soldering; Temperature sensors; Testing; Thermal degradation;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Components and Technology Conference, 2005. Proceedings. 55th
  • Conference_Location
    Lake Buena Vista, FL
  • ISSN
    0569-5503
  • Print_ISBN
    0-7803-8907-7
  • Type

    conf

  • DOI
    10.1109/ECTC.2005.1441386
  • Filename
    1441386
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=3348141