DocumentCode :
3348634
Title :
Study on the Electrical Performance of 80 μm Pitch Bumpless Bonding for Several GHz Interconnections
Author :
Saito, Keisuke ; Fujii, Takao ; Akiyama, Yutaka ; Usami, Tamotsu ; Otsuka, Kanji ; Suga, Tadataomo
fYear :
2005
fDate :
May 31 2005-June 3 2005
Firstpage :
1127
Lastpage :
1131
Keywords :
Bonding; Electronics packaging; Flexible printed circuits; Flip chip; Frequency; Inductance; Informatics; Integrated circuit interconnections; Power transmission lines; Transmission lines;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronic Components and Technology Conference, 2005. Proceedings. 55th
Conference_Location :
Lake Buena Vista, FL
ISSN :
0569-5503
Print_ISBN :
0-7803-8907-7
Type :
conf
DOI :
10.1109/ECTC.2005.1441414
Filename :
1441414
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=3348634
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