• DocumentCode
    3348634
  • Title

    Study on the Electrical Performance of 80 μm Pitch Bumpless Bonding for Several GHz Interconnections

  • Author

    Saito, Keisuke ; Fujii, Takao ; Akiyama, Yutaka ; Usami, Tamotsu ; Otsuka, Kanji ; Suga, Tadataomo

  • fYear
    2005
  • fDate
    May 31 2005-June 3 2005
  • Firstpage
    1127
  • Lastpage
    1131
  • Keywords
    Bonding; Electronics packaging; Flexible printed circuits; Flip chip; Frequency; Inductance; Informatics; Integrated circuit interconnections; Power transmission lines; Transmission lines;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Components and Technology Conference, 2005. Proceedings. 55th
  • Conference_Location
    Lake Buena Vista, FL
  • ISSN
    0569-5503
  • Print_ISBN
    0-7803-8907-7
  • Type

    conf

  • DOI
    10.1109/ECTC.2005.1441414
  • Filename
    1441414
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=3348634