DocumentCode
3348881
Title
Exploring the limits of low cost, organics-compatible high-k ceramic thin films for embedded decoupling applications
Author
Balaraman, Devarajan ; Raj, P.M. ; Abothu, Robin ; Bhattacharya, S. ; Sacks, Michael ; Lance, Michael ; Meyer, Harry ; Swaminathan, Madhavan ; Tumrnala, R.
Author_Institution
Packaging Res. Center, Georgia Inst. of Technol., Atlanta, GA, USA
fYear
2005
fDate
31 May-3 June 2005
Firstpage
1215
Abstract
This paper presents four organic-compatible thin film processing techniques for embedding capacitors into organic PWBs. Hydrothermal synthesis allows integration of pure nano-grained barium titanate films with capacitance density of about 1 μF/cm2. Sol-gel and RF-sputtering in conjunction with a foil transfer process can be used to integrate a variety of perovskite thin films with the capacitance in the range of 200-400 nF/cm2. Thermal oxidation of titanium foil also emerges as a viable process for integrating capacitance of 100s of nF using a foil transfer process. The dielectric properties of the films synthesized by these techniques as a function of various process parameters are presented. Observed dielectric properties like dielectric constant, leakage current and breakdown strengths have been correlated to structural defects and stoichiometry of the films.
Keywords
dielectric thin films; leakage currents; permittivity; printed circuits; sol-gel processing; sputter deposition; RF sputtering; breakdown strengths; dielectric constant; dielectric thin film properties; embedded decoupling applications; embedding capacitors; film stoichiometry; foil transfer process; high-k ceramic thin films; hydrothermal synthesis; leakage current; nano-grained barium titanate films; organic printed wiring boards; organic-compatible thin film processing techniques; perovskite thin films; process parameters; sol gel; structural defects; thermal oxidation; titanium foil; Barium; Capacitance; Capacitors; Ceramics; Costs; Dielectric thin films; High K dielectric materials; High-K gate dielectrics; Titanium compounds; Transistors;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Components and Technology Conference, 2005. Proceedings. 55th
ISSN
0569-5503
Print_ISBN
0-7803-8907-7
Type
conf
DOI
10.1109/ECTC.2005.1441425
Filename
1441425
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