Absolute and relative fatigue life prediction methodology for virtual qualification and design enhancement of lead-free BGA

The semiconductor industry is driving toward lead-free solder due to environmental concern and legislation requirement. The industry has also concluded that SnAgCu solder alloy so far is the best lead-free alternative to SnPb solder. Therefore, most existing and new packages have to be tested and qualified using lead-free solder. One of the critical concerns is board level solder joint reliability during thermal cycling test. In this paper, the methodology for an absolute life prediction is described for virtual qualification of packages. A good absolute fatigue life prediction requires an appropriate solder creep model and actual test data on packages. Two new sets of lead-free Anand´s constants for SnAgCu solder are introduced for creep models. These Anand´s creep models are compared with other lead-free and eutectic solder model and the relative design trend is similar. A fatigue corrective factor is introduced to integrate the different solder models together for convenient relative design enhancement with acceptable range of absolute life prediction. These fatigue corrective factors can also be used to compare different finite element modeling assumptions such as element size and solution time step. Subsequently, design analysis is performed to study the effects of 11 key package dimensions and material properties. It is found that the relative design trend for packages with lead-free and eutectic solder is similar. Therefore, the design guidelines established for the previous eutectic solder is still valid for lead-free solder.