DocumentCode
3349267
Title
Recent Advances in Ceramic Composite Substrate Materials for High-Density and High Reliability Packaging Applications
Author
Kumbhat, Nitesh ; Raj, P. Markondeya ; Pucha, Raghuram V. ; Atmur, Steve ; Doraiswamy, Ravi ; Sundaram, Venky ; Bhattacharya, Swapan ; Sitaraman, Suresh K. ; Tummala, Rao R.
fYear
2005
fDate
May 31 2005-June 3 2005
Firstpage
1364
Lastpage
1372
Keywords
Ceramics; Composite materials; Dielectric substrates; Electronic packaging thermal management; Materials reliability; Organic materials; Residual stresses; Testing; Thermal stresses; Wiring;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Components and Technology Conference, 2005. Proceedings. 55th
Conference_Location
Lake Buena Vista, FL
ISSN
0569-5503
Print_ISBN
0-7803-8907-7
Type
conf
DOI
10.1109/ECTC.2005.1441447
Filename
1441447
Link To Document