Challenges of megapixel camera module assembly and test

Driven by the market growth of mobile phones with camera, production of image sensor devices has increased dramatically in recent years. From 2004 an increasing number of these mobile phones contain megapixel cameras. The packaging of an image sensor in a camera module presents several unique engineering challenges. Megapixel camera module assembly poses further challenges due to more stringent particle control criteria. For particle control, special attention has to be given on facilities control, equipment and material selection, process flow, discipline among line personnel and continuous particle reduction effort. Other material, process and equipment selection criteria for megapixel module are also discussed. Test for megapixel camera module also has its own challenges. This paper discusses these challenges and methods to meet them.